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ABS Injection Molding for Electronic DevicesClick to zoom
Electronic Parts

ABS Injection Molding for Electronic Devices

Custom-engineered projectBuilt in Shenzhen, ChinaExample shown with customer permission

White ABS electronic frame from a single-cavity H13 HASCO mold with a cosmetic surface.

Part materialABS
Cavity / core steelAISI H13
Runner systemCold runner
CavitiesSingle cavity
ProcessingABS, injection molding, plastic molding
Mold standardHASCO
Free DFM reviewMoldability checked before quoting
T1 samples + FAIApprove before production
NDA on requestYour design stays confidential
ISO 9001:2015Inspection at every stage

Description

ABS injection molding for electronics

ABS injection molding is one of the most widely used processes for electronic plastic parts. ABS pellets are melted and injected into the mold cavity under high pressure; the mold cools the material until it solidifies in the shape of the part. The process is precise and repeatable, which makes it ideal for high-volume production of detailed parts.

This white ABS frame for an electronic device was produced in a single-cavity AISI H13 mold with a cold runner on a HASCO base.

Why ABS suits electronic parts

  • Good surface finish and easy colouring, important for white and light-coloured parts.
  • Toughness for frames and covers that are handled and assembled.
  • Dimensional stability for snap fits and screw bosses.
  • Low processing temperature, which keeps cycles short and quality stable.

Getting a clean white part

White parts show every defect. We dry the resin, keep the material path clean to avoid black specks, place gates on hidden faces and polish the cavity to the required finish. Colour is approved on T1 samples against your reference.

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  1. 1Upload STEP / IGES / STL / DWG / PDF. We sign an NDA on request.
  2. 2We review wall thickness, draft, gating, undercuts and tolerances, and propose steel, cavities, runner and mold standard.
  3. 3You receive the mold and part quotation, with a free design check (DFM report) showing any risks we found.

Project details

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